设计简介
摘要
IC封装是半导体三大产业之一(器件设计、晶片制作和器件封装)。其后封装工序主要包括:划片、粘片、超声球焊、封装、检测、包装。划片机是IC后封装线上的第一道关键设备，其作用是把制作好的晶片切割成单元器件，为下一步单元晶片粘接做好准备。但由于与国外技术存在差距，目前我国高端划片机仍然依赖进口。为了促进IC封装设备的国产化，本设计对划片机进行了总体规划并且对关键零部件进行了详细设计
在分析划片工艺要求的基础上，确定了划片机的主要功能，进而进行了划片机的各部分功能的原理方案设计。其次，提出了四种不同的结构方案，并详细对比了其优缺点，然后确定了结构方案设计，完成了划片机的总体规划。
接下来，针对划片工艺要求，进行了各部分结构的初步设计，包括各轴的传动方案、支承方案以及相关的结构参数。然后，根据课题要求，对划片机的Y、Z轴进行了详细设计，通过计算，分别完成了Y、Z轴的丝杠螺母机构的选型、电机的选型、导轨的选型。最后，完成了划片机Y、Z轴的装配图。
关键字：划片机；总体规划；结构设计；滚珠丝杠；步进电机；滚动直线导轨；
Abstract
IC packaging is one of the semiconductor industry( device design, wafer fabrication, and packaging ) . Subsequently packaging processes include : dicing , die attach , ultrasonic ball bonding , packaging , testing and packaging. Scribing machine is the key equipment after the first line of the IC package , its role is to make a good wafer into single components , ready for the next unit wafer bonding. But because there is a gap with foreign technology , China's high- scribing machine is still dependent on imports. In order to promote the localization of IC packaging equipment , the overall plan and key components＇detail design of a dicing machine are been done in this design.
On the basis of analyzing the dicing process, dicing machine main function is been defined. Then the design of principal program, of each part's function, is been done. Secondly, four different structural schemes are proposed, and a detailed comparison of their advantages and disadvantages is showed in the article, and then the structure of the program design is determine, a master plan dicing machine completed.
Next, for the dicing process requirements, a preliminary design of each part of the structure is completed, including the drive shaft of the program, support programs and related structural parameters. Then, according to the task requirements, Y, Z axis dicing machine are designed in detail. By calculating, the Y, the selection of screw nut body, the selection of the motor, and rail are Completed. Finally, the assembly drawing of Z-axis Y-axis are completed.
Key words:
Scribing machine; overall planning; structural design; ball screws; stepper motor; rolling linear guide
目录
1 绪论 4
1.1 引言 4
1.2 划片机的发展过程 4
1.3 划片机的国内外发展现状 5
1.4 设计任务及要求 6
2 划片机的总体方案设计 6
2.1 划片机的技术要求 6
2.2 划片机的原理方案设计 7
2.2.1 划片机砂轮驱动系统的原理方案设计 7
2.2.2 划片机X、Y、Z轴的原理方案设计 7
2.2.3 划片机θ轴的原理方案设计 7
2.2.4 划片机晶片固定方案设计 8
2.2.5 划片机晶片定位方案设计 8
2.2.6 划片机的控制方案 8
2.2.7 划片机的冷却、保护方案设计 8
2.3 划片机的结构方案设计 9
3 划片机结构参数的初步设计 10
3.1 划片机主轴的参数的初步设计 10
3.2 划片机晶片定位机构参数的初步设计 11
3.3 划片机晶片固定系统参数的初步设计 11
3.4 划片机X轴的初步设计 12
3.5 划片机Y轴的初步设计 13
3.6 划片机Z轴的初步设计 13
3.7 划片机θ轴的初步设计 14
4 划片机轴Z和Y轴的详细设计 14
4.1 划片机Z轴的详细设计 14
4.1.1 Z轴滚珠丝杠的设计 14
4.1.2 Z轴电机的选型 16
4.1.3 Z轴导轨的选型 17
4.2 划片机Y轴的详细设计 18
4.2.1 Y轴滚珠丝杠的设计 18
4.2.2 Y轴电机的选型 19
4.2.3 Y轴导轨的选型 21
5 结束语 22
致谢 22
IC封装是半导体三大产业之一(器件设计、晶片制作和器件封装)。其后封装工序主要包括:划片、粘片、超声球焊、封装、检测、包装。划片机是IC后封装线上的第一道关键设备，其作用是把制作好的晶片切割成单元器件，为下一步单元晶片粘接做好准备。但由于与国外技术存在差距，目前我国高端划片机仍然依赖进口。为了促进IC封装设备的国产化，本设计对划片机进行了总体规划并且对关键零部件进行了详细设计
在分析划片工艺要求的基础上，确定了划片机的主要功能，进而进行了划片机的各部分功能的原理方案设计。其次，提出了四种不同的结构方案，并详细对比了其优缺点，然后确定了结构方案设计，完成了划片机的总体规划。
接下来，针对划片工艺要求，进行了各部分结构的初步设计，包括各轴的传动方案、支承方案以及相关的结构参数。然后，根据课题要求，对划片机的Y、Z轴进行了详细设计，通过计算，分别完成了Y、Z轴的丝杠螺母机构的选型、电机的选型、导轨的选型。最后，完成了划片机Y、Z轴的装配图。
关键字：划片机；总体规划；结构设计；滚珠丝杠；步进电机；滚动直线导轨；
Abstract
IC packaging is one of the semiconductor industry( device design, wafer fabrication, and packaging ) . Subsequently packaging processes include : dicing , die attach , ultrasonic ball bonding , packaging , testing and packaging. Scribing machine is the key equipment after the first line of the IC package , its role is to make a good wafer into single components , ready for the next unit wafer bonding. But because there is a gap with foreign technology , China's high- scribing machine is still dependent on imports. In order to promote the localization of IC packaging equipment , the overall plan and key components＇detail design of a dicing machine are been done in this design.
On the basis of analyzing the dicing process, dicing machine main function is been defined. Then the design of principal program, of each part's function, is been done. Secondly, four different structural schemes are proposed, and a detailed comparison of their advantages and disadvantages is showed in the article, and then the structure of the program design is determine, a master plan dicing machine completed.
Next, for the dicing process requirements, a preliminary design of each part of the structure is completed, including the drive shaft of the program, support programs and related structural parameters. Then, according to the task requirements, Y, Z axis dicing machine are designed in detail. By calculating, the Y, the selection of screw nut body, the selection of the motor, and rail are Completed. Finally, the assembly drawing of Z-axis Y-axis are completed.
Key words:
Scribing machine; overall planning; structural design; ball screws; stepper motor; rolling linear guide
目录
1 绪论 4
1.1 引言 4
1.2 划片机的发展过程 4
1.3 划片机的国内外发展现状 5
1.4 设计任务及要求 6
2 划片机的总体方案设计 6
2.1 划片机的技术要求 6
2.2 划片机的原理方案设计 7
2.2.1 划片机砂轮驱动系统的原理方案设计 7
2.2.2 划片机X、Y、Z轴的原理方案设计 7
2.2.3 划片机θ轴的原理方案设计 7
2.2.4 划片机晶片固定方案设计 8
2.2.5 划片机晶片定位方案设计 8
2.2.6 划片机的控制方案 8
2.2.7 划片机的冷却、保护方案设计 8
2.3 划片机的结构方案设计 9
3 划片机结构参数的初步设计 10
3.1 划片机主轴的参数的初步设计 10
3.2 划片机晶片定位机构参数的初步设计 11
3.3 划片机晶片固定系统参数的初步设计 11
3.4 划片机X轴的初步设计 12
3.5 划片机Y轴的初步设计 13
3.6 划片机Z轴的初步设计 13
3.7 划片机θ轴的初步设计 14
4 划片机轴Z和Y轴的详细设计 14
4.1 划片机Z轴的详细设计 14
4.1.1 Z轴滚珠丝杠的设计 14
4.1.2 Z轴电机的选型 16
4.1.3 Z轴导轨的选型 17
4.2 划片机Y轴的详细设计 18
4.2.1 Y轴滚珠丝杠的设计 18
4.2.2 Y轴电机的选型 19
4.2.3 Y轴导轨的选型 21
5 结束语 22
致谢 22
